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Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
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SPEA Expands in Southeast Asia with New Subsidiary in Thailand
SPEA, a global leader in automatic test equipment for the manufacturing of semiconductor, microelectronic and electronic devices, today announced the...
Würth Elektronik in United States Embarks on New Milestone with State-of-the-Art Headquarters
Würth Elektronik in the United States, a leading manufacturer of electronic and electromechanical components as well as custom magnetics, has...
Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
As one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of...
Nortech Systems Reports Q1 Results and Actions to Reduce Facility Costs
Nortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products...
Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real...
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on...
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 17, 2024 | Andy Shaughnessy, Design007 Magazine
This week, trade shows are at the top of our feed, with our coverage of the Del Mar Electronics and Manufacturing Show and IPC APEX EXPO. These two longtime events are almost polar opposites in size and scope, but Del Mar seems to be expanding from its roots as a “neighborhood gathering” with its move into the Del Mar Fairgrounds. The Del Mar show always has a good “buzz factor,” which is something you can’t buy.
Listen Up: Popular Podcast Series Returns With Discussion of Electroless Copper
May 16, 2024 | I-Connect007
In the latest episode of the podcast series, On the Line With: Designing for Reality, Nolan Johnson returns to Sunstone Circuits in Mulino, OR, to continue down the manufacturing process with Matt Stevenson.
MORE ARTICLES
Global Sourcing Spotlight: Golf, Friedman, and the Benefits of Global Sourcing
May 8, 2024 | Bob Duke, Global Sourcing Spotlight
When I started working on global sourcing for American Standard Circuits, a friend sent me a book by the NY Times economist Thomas Friedman called The Lexis and the Olive Tree. Well, not being a fan of the NYT or even economists as a...
Nolan’s Notes: Coming to Terms With AI
May 7, 2024 | Nolan Johnson, Nolan's Notes
How fast do things move in the world of data analytics? Here’s an example. We’ve been planning this issue on artificial intelligence for the past few months, and, in fact, I had already written this column about a month ago. Then...
The Knowledge Base: A CM’s Perspective on Box Build Practices
April 30, 2024 | Mike Konrad, The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic...
SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1
April 17, 2024 | Dr. Jennie Hwang, SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and...
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- Using AI to Redefine Productivity with Amin Arbabian, Anders Holden, Raj Vora, and Luis Vidal
- Empowering the Smart Factory Era With AI by Joel Scutchfield and Brent Fischthal
- A Glossary of Artificial Intelligence Terms
- Chiplet Architecture for AI Will Create New Demands for Assembly with Arvind Kumar
- The Rise of Collaborative Intelligence in Manufacturing by Jennifer Davis