PCBDESIGN007 - An IConnect007 Publication
Tweet This ArticleTweet    Send Us Feedback About This ArticleFeedback    E-Mail This Article To A FriendE-Mail    Print This ArticlePrint
TechSearch Releases Analysis on 3D TSV Market
Thursday, August 16, 2012 | TechSearch

TechSearch International has released its analysis of the 3D TSV market and alternatives such as Package-on-Package (PoP) and 2.5D (interposers with TSVs). The new study, 3D TSV Markets: Applications, Issues, and Alternatives, contains a realistic five year market forecast for PoP, 2.5D, and 3D TSV applications in units and wafers. A considerable amount of work has been underway for several years to develop 3D TSV technology for high volume manufacturing, but challenges are slowing the commercialization despite the strong desire to use the technology.

While the drivers for 3D ICs remain constant, the time line for its adoption keeps shifting out into the future. Several technical challenges and infrastructure issues such as business logistics are delaying the full commercialization of TSV technology for 3D ICs. The major issues are:

  • EDA tool availability including the ability to use thermally aware tools and the ability to communicate between tools
  • Manufacturing yield in key process steps such as debonding during wafer thinning
  • Thermal dissipation and cooling methods
  • Test methodology
  • Infrastructure-related issues, including logistic supply chain handoff
  • Reliability data for a broad range of applications
  • Unit device cost compared to alternatives

Once the 3D TSV technical challenges are resolved and the technology becomes cost-effective, business challenges will remain until the industry settles on a model. As the boundary between foundry and assembly processes continues to blur, there will be a struggle to determine which organizations can best meet the customer’s needs for assembly and test. Any one of these issues has the potential to limit a full 3D TSV implementation, and these challenges are driving many companies to seek alternative packaging and assembly solutions until they can be solved.

Full text analysis provides critical details of challenges and alternatives. The report is 122 pages with full references. A complimentary set of 78 PowerPoints accompanies the report.  

About TechSearch International, Inc.

TechSearch International, Inc., founded in 1987, is a market research firm specializing in technology trends, microelectronics packaging and assembly. Research topics include flip chip, WLPs, CSPs, BGAs, SiPs, 3D packaging, Pb-free and high brightness LEDs. For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or http://www.techsearchinc.com.


To sign up for our newsletters, click here.

Tweet This ArticleTweet    Send Us Feedback About This ArticleFeedback    E-Mail This Article To A FriendE-Mail    Print This ArticlePrint



MOST READ
MOST EMAILED