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TechSearch Expects Double-Digit Growth for PoP
Thursday, May 19, 2011 | TechSearch

Package-on-package (PoP) volumes continue to grow with a CAGR of 31% from 2009 to 2015.  Applications driving this double-digit growth include mobile phones (especially smartphones), tablets, games, iPods, and digital cameras. “This high growth and broad adoption has been driven by the continuous advancements that PoP has delivered.  When Amkor ramped PoP in 2005 the mobile processor clock was 330MHz with a 0.65mm pitch interface to the top SDRAM/NOR combo memory.  Now processor speeds exceed 1 GHz with a 0.4mm pitch interface to the top low power DDR, with near term roadmaps exceeding 2.5 GHz and high-density PoP interfaces supporting two channel LP DDR2.  With more than four billion mobile processors forecasted for smart device applications in the next four years, PoP growth and advancements will continue at a high rate,” stated Lee Smith, V.P. of Marketing and Business Development at Amkor Technology. 

PoP provides a cost/performance solution that solves business and logistics issues associated with stacking devices directly—something that cannot yet be met by 3D TSV technology.  Memory and the logic packages can be tested separately before assembly.  Standardization of the top memory package footprint allows memory packages from various suppliers to be interchanged.   Memory devices are wire bonded in the top package, but the logic device in the bottom package is migrating to flip chip, including copper pillar.

The latest issue of TechSearch International’s Advanced Packaging Update contains a unit forecast for PBGAs, TBGAs, and CBGAs.  Forecasts for FBGAs, QFNs, flex-substrate CSPs, and stacked die CSPs are also provided.  Market estimates for each package type are based on input from both captive and merchant assembly operations.  Key applications and drivers for unit volume growth are highlighted.  The report also includes an analysis of the impact of the tragic events in Japan on the electronics industry infrastructure. A special section provides insights into packages for automotive electronics.  Included in the Update Service is a complimentary set of PowerPoint slides.

About TechSearch International

TechSearch International, Inc., founded in 1987, is a market research firm specializing in technology trends microelectronics packaging and assembly.  Multi- and single-client services encompass technology licensing, strategic planning, and market and technology analysis.  TechSearch International professionals have an extensive network of more than 15,000 contacts in North America, Asia, and Europe.  For more information, contact TechSearch at tel: 512-372-8887, fax: 512-372-8889, or www.techsearchinc.com.     


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