Flex Interconnect Technologies (FIT), a leading solutions provider for all aspects of flexible printed circuitry, announced today that Raj Badoni has been named its new Director of Sales and Marketing.

"Raj's extensive background in the semiconductor industry, and blend of technical and business management experience, will be instrumental in strengthening our existing customer relationships, and developing new ones," said Chetan Shah, FIT's Co-founder and President. "His passion and technical problem-solving skills will enable new solutions for our customers."

Badoni has over 13 years of experience in the semiconductor industry, specializing in technology development, manufacturing, yield management and capital equipment applications and marketing. Prior to joining FIT, he worked in a global product marketing role at KLA-Tencor, bringing product solutions to customers in North America, Asia Pacific, Japan and Europe. In the industry, Badoni implemented best practices to help engineering customers develop and launch new products, significantly optimizing their time-to-market. 

Badoni holds Master's Degrees from the University of North Texas and Indian Institute of Technology, a graduate management certification from Stanford University, and has published multiple papers on semiconductor technology.

About FIT

Flex Interconnect Technologies (FIT) is a leading flex circuit solutions provider, serving the High-End Computer, Medical, Defense, Aerospace, Semiconductor, Automotive and other industries with high-reliability product needs. From design through assembly, FIT offers end-to-end custom flex circuit, rigid-flex and HDI circuit solutions, providing customers with responsiveness, technical guidance and certified quality. FIT is AS9100B, ISO9001:2000 and FDA's QSR part 820B certified and ITAR registered.  Their partial client list includes: Northrop Grumman, Lockheed Martin, GE Medical, HP and Intel. For more information, visit http://www.fit4flex.com/ or call 415-375-3038.