Expert presenters will lead more than 30 courses covering SMT process fundamentals for tin lead and lead-free; cleaning/coating/contamination; design; emerging technologies; environmental issues and compliance; PCB fabrication and materials; quality, reliability and test; and supply chain/business issues.

This full-day event focused on PCB design will be held in conjunction with IPC APEX Expo, and will offer practical information and real-world applications in design.

Ah, 2009. It was the year of ITAR. The year of new IPC current-carrying guidelines. The year you tried to stay busy by organizing your CAD library. But through it all, most designers and EEs held onto their jobs. Here's a look back at the year that tested our resolve.

Many industry experts assume new flex devices will become available, such as flexible displays and flexible solar cells. Ten-year sales forecasts published by several marketing research firms estimate the market will grow quickly and reach the multi-billion-dollar level in a short time.

Flat-Wrap Technology provides a solution to Copper Wrap Plate problems. Flat-Wrap allows for copper wrap plate without the build up of surface copper thickness. This aspect of this technology provides the benefit of producing highly reliable PCBs without sacrificing fabrication capability.

Green design derives from the IEC62368 standard, currently being considered as a standard for audio/video and IT equipment. Authored by Dr. Robert D. Hilty of Tyco Electronics and Dr. Tamim P. Sidiki and Joanne Shipe of DSM Engineering Plastics, this paper explains the ramifications of the move to halogen-free green design. The paper was presented at IPC APEX EXPO 2009.

Light can be seen at the end of the economic tunnel. The consumer electronics industry in Taiwan began to rebound in February and the recovery spread to Korea and China and, finally, to Japan. This spike in business brings a few new problems for manufacturing companies.

A lot happens behind closed doors in Las Vegas, and IPC APEX EXPO was no exception. Volunteers--people just like you--attended committee meetings focused on IPC standards, management strategies and the electronics manufacturing industry.

IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2010 IPC APEX EXPO at Mandalay Bay Resort and Convention Center in Las Vegas, Nevada April 6-9, 2010.

Since the implementation of the RoHS Directive in 2006, the focus of attention in electronics soldering has been the development of lead-free materials and processes. However, it is not the case that lead has disappeared from the soldering scene--it is still very much alive.

Flat-Wrap Technology provides a solution to Copper Wrap Plate problems. Flat-Wrap allows for copper wrap plate without the build up of surface copper thickness. This aspect of this technology provides the benefit of producing highly reliable PCBs without sacrificing fabrication capability.

Green design derives from the IEC62368 standard, currently being considered as a standard for audio/video and IT equipment. Authored by Dr. Robert D. Hilty of Tyco Electronics and Dr. Tamim P. Sidiki and Joanne Shipe of DSM Engineering Plastics, this paper explains the ramifications of the move to halogen-free green design. The paper was presented at IPC APEX EXPO 2009.

A lot happens behind closed doors in Las Vegas, and IPC APEX EXPO was no exception. Volunteers--people just like you--attended committee meetings focused on IPC standards, management strategies and the electronics manufacturing industry.

Since the implementation of the RoHS Directive in 2006, the focus of attention in electronics soldering has been the development of lead-free materials and processes. However, it is not the case that lead has disappeared from the soldering scene--it is still very much alive.

Printed electronics will open doors to markets we have never thought of. This is a tremendous opportunity for fabricators. There's also a real danger here, however. Will you be ready?

New technologies will turn traditionally dumb products and systems into smart ones to gain new efficiencies and new capabilities. In addition, entire industries will transform using electric systems and electronics as their platforms.

Harvey Miller, inspired by a Real Time with IPC video interview with inventor, entrepreneur, author and futurist Ray Kurzweil scours the Internet to compare our current economic situation with depressions of the past.

Real Time With...IPC is not just about covering exhibitors and their products. Our team of editors and guest-editors spoke with dozens of CEOs and senior executives to find out how our industry is "weathering the storm."

"Innovation is a catalyst for growth that is especially crucial in times of economic downturn, enabling companies to protect their presence in the marketplace," said Tony Hilvers, IPC vice president of industry programs. "Regardless of the economy, technology continues to advance and these products will make vital contributions to our industry."

Intel Corporation, IBM and Hewlett-Packard Company will take the stage at the IPC APEX EXPO OEM Summit to define key issues they are facing in halogen-free materials, materials reliability and supplier quality.

Ah, 2009. It was the year of ITAR. The year of new IPC current-carrying guidelines. The year you tried to stay busy by organizing your CAD library. But through it all, most designers and EEs held onto their jobs. Here's a look back at the year that tested our resolve.

Many industry experts assume new flex devices will become available, such as flexible displays and flexible solar cells. Ten-year sales forecasts published by several marketing research firms estimate the market will grow quickly and reach the multi-billion-dollar level in a short time.

Flat-Wrap Technology provides a solution to Copper Wrap Plate problems. Flat-Wrap allows for copper wrap plate without the build up of surface copper thickness. This aspect of this technology provides the benefit of producing highly reliable PCBs without sacrificing fabrication capability.

If you design boards for the European Union, this technical paper is for you. Vern Solberg addresses three issues designers need to consider during the planning phase of new product development: Component selection for lead-free applications, product exemption criteria and specifying compatible PCB material and finish. This paper was presented at IPC APEX EXPO 2009.

Green design derives from the IEC62368 standard, currently being considered as a standard for audio/video and IT equipment. Authored by Dr. Robert D. Hilty of Tyco Electronics and Dr. Tamim P. Sidiki and Joanne Shipe of DSM Engineering Plastics, this paper explains the ramifications of the move to halogen-free green design. The paper was presented at IPC APEX EXPO 2009.

This paper, written by Vern Solberg of Solberg Technology Consulting and presented at IPC APEX Expo 2009, compares different common technologies including flip-chip, chip-size and wafer level array package methodologies detailed in the new IPC-7094 publication. It considers the effect of bare die or die-size components in an uncased or minimally cased format and reviews PCB design guidelines to ensure efficient assembly processing.

Light can be seen at the end of the economic tunnel. The consumer electronics industry in Taiwan began to rebound in February and the recovery spread to Korea and China and, finally, to Japan. This spike in business brings a few new problems for manufacturing companies.

A lot happens behind closed doors in Las Vegas, and IPC APEX EXPO was no exception. Volunteers--people just like you--attended committee meetings focused on IPC standards, management strategies and the electronics manufacturing industry.

Since the implementation of the RoHS Directive in 2006, the focus of attention in electronics soldering has been the development of lead-free materials and processes. However, it is not the case that lead has disappeared from the soldering scene--it is still very much alive.

Attendance was up year-on-year at last week's Del Mar Electronics Show. What is it about this small show in San Diego that draws PCB manufacturers from all over the country?

Ah, 2009. It was the year of ITAR. The year of new IPC current-carrying guidelines. The year you tried to stay busy by organizing your CAD library. But through it all, most designers and EEs held onto their jobs. Here's a look back at the year that tested our resolve.

Many industry experts assume new flex devices will become available, such as flexible displays and flexible solar cells. Ten-year sales forecasts published by several marketing research firms estimate the market will grow quickly and reach the multi-billion-dollar level in a short time.

Light can be seen at the end of the economic tunnel. The consumer electronics industry in Taiwan began to rebound in February and the recovery spread to Korea and China and, finally, to Japan. This spike in business brings a few new problems for manufacturing companies.

Since the implementation of the RoHS Directive in 2006, the focus of attention in electronics soldering has been the development of lead-free materials and processes. However, it is not the case that lead has disappeared from the soldering scene--it is still very much alive.

Printed electronics will open doors to markets we have never thought of. This is a tremendous opportunity for fabricators. There's also a real danger here, however. Will you be ready?

Harvey Miller, inspired by a Real Time with IPC video interview with inventor, entrepreneur, author and futurist Ray Kurzweil scours the Internet to compare our current economic situation with depressions of the past.

Even though IPC APEX Expo is going to have fewer exhibitors and attendees, that doesn't mean there is ample opportunity on both sides of the exhibition equation.

History repeats itself and, unfortunately, most of us pay no attention to mistakes made in the past. The economy has its ups and downs and we sometimes forget about the risks looming around the corner during strong economic times.

The economy slowed, but technological innovation didn't. In 2008 we saw a plethora of new PCB design and design engineering tools enter the market, and plenty of great ideas as well. Take a look back at a year full of surprises.

More than a thousand companies, universities and research organizations dedicate resources toward business applications or R&D activities for nanotechnologies.