Viking Modular Solutions, a division of Sanmina-SCI Corporation, and leading manufacturer of innovative DRAM modules and flash solutions, today announced that its SATADIMM is available for immediate customer qualification.

The 2010 release of Microwave Office offers new functionality and tools to increase productivity for high-frequency monolithic microwave integrated circuit, MIC, RF PCB and module designers.

With Ansoft Designer 6.0's new Solver on Demand technology from ANSYS, electronic design engineers can now quickly and accurately analyze signal-integrity, power-integrity and electromagnetic interference problems from a single schematic- and layout-based environment.

Q Rate Coax and Twinax Cable Assemblies feature rugged, high-performance Edge Rate contacts and an integral metal power/ground plane which provide for superior electrical performance.

The solution uses Cadence Encounter Power System and Allegro Package Designer, combined with support from third-party package analysis providers, to implement a standard format for die modeling.

The new IGI Phototooling Toolbox features a unique approach and rich feature set that make it ideally suited for niche applications with specialized requirements not addressed by traditional mainstream products.

The new high-capacity machine, four years in development, features eight dual-sense test heads, and can support "Hot Swap" technology. This new application allows individual coupons that have just been tested to be "swapped out" with new coupons, without stopping testing in progress.

AXIEM 2010 includes new features and capabilities that are ideal for large, planar, antenna designs such as arrays with many elements. Critical design problems, such as scan blindness, can now be discovered and corrected.

Obzerv Technologies has launched its Modular Active Range-Gated Camera, which is targeted at Airborne Multi-Spectral Imaging Turrets manufacturers.

The Sphinx for Signoff signal and power integrity co-simulator allows IC packaging and PCB designers to quickly, accurately, and confidently verify the performance of their designs before release to manufacturing.

John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth.

I-Connect007's team of editors, guest editors, videographers and video editors worked throughout the show to capture the keynotes, the industry's top technologists and business leaders, bringing our readers and viewers the world's most comprehensive event coverage and content.

Rogers Corporation introduced RO2808--a new high-frequency, low-loss, ceramic-filled PTFE material--at DesignCon 2009. Market Development Manager Young Gao and Product Specialist Joey Kellner discuss the capabilities of this new PTFE material and what market sectors the product could benefit.

"Mentor's topology router technology significantly decreases design cycle time, increases designer productivity and quality of the board, and optimizes performance."

Oak Mitsui and Ohmega Technologies have just been granted a brand new patent that could give embedded materials users exactly what they've been wishing for--a lower cost embedded resistance/capacitance solution.

vShare provides a centralized, scalable platform with secure access to important design information and DFM issues that form part of the product development process.

John Ritchie, Product Manager for Rogers Corporation, reviews his company's new high-frequency laminate product, RO4360, which features a Dk of 6.15. The new product can address issues concerning what Ritchie sees as three mega-trends in the industry: The drive toward mass transit, sustainable energy and Internet growth.

Designers should familiarize themselves with IPC-2152 - Standard for Determining Current Carrying Capacity in Printed Board Design. But in the meantime, designers Jack Olson and Borko Bozickovic have developed a free Trace Width Calculator to help designers make these adjustments.

Cadence Design Systems recently released OrCAD version 16.3. OrCAD Senior Product Marketing Manager Josh Moore sat down with Editor Andy Shaughnessy to discuss the latest updates.

Yesterday, Cadence Design Systems launched Cadence Allegro and OrCAD PCB Design Release 16.3 and Allegro IC Packaging/SiP Design Release 16.3. PCBDesign007 recently visited Cadence's office in Chelmsford, Massachusetts and discussed 16.3 with Keith Felton, Hemant Shah, Brad Griffin, Linda Mazzitelli and Josh Moore.

Typical glass fibers can present an uneven pattern to the copper traces overlaid upon them, and that can lead to signal skew and timing errors. John Kuhn of Dielectric Solutions discusses a new, tighter fiber weave that can help eliminate "fiber weave effect" and the attendant signal integrity problems.

PCB designers would love to be able to create a library part and take it into all EDA design tool vendors' formats, without spending too much time and money. ADI's Frank Frank and Mike Wilson explain how ADI stepped in to fill that need with Ultra Librarian.

Remote sensor nodes--used for energy harvesting and environmental monitoring--were the talk of the Sensor Expo in Chicago, Illinois. Will these motes fuel the next killer app for the electronics industry?

JPCA Show 2009, the largest event for PCB and related industries, was held at Tokyo Big Sight June 3-5, 2009. Dominique Numakura, DKN Research; Matthew Holzmann, Christopher Associates; Bob Neves, Microtek Laboratories; and David Bergman, IPC report show highlights.

Cadence Design Solutions recently launched FPGA System Planner for the OrCAD and Allegro platforms. Allegro Product Marketing Manager Hemant Shah explains how this FPGA-PCB co-design suite optimizes FPGA pin assignement and helps detect errors early in the process.

As Downstream Technologies founder Rick Almeida explains, PCB designers often consider postprocessing to be a "necessary evil." But CAM350XL, a suite that encompasses DownStream's CAM350 and BluePrint tools, may change that.

PCB designers would love to be able to create a library part and take it into all EDA design tool vendors' formats, without spending too much time and money. ADI's Frank Frank and Mike Wilson explain how ADI stepped in to fill that need with Ultra Librarian.

Remote sensor nodes--used for energy harvesting and environmental monitoring--were the talk of the Sensor Expo in Chicago, Illinois. Will these motes fuel the next killer app for the electronics industry?

Cadence Design Solutions recently launched FPGA System Planner for the OrCAD and Allegro platforms. Allegro Product Marketing Manager Hemant Shah explains how this FPGA-PCB co-design suite optimizes FPGA pin assignement and helps detect errors early in the process.

As Downstream Technologies founder Rick Almeida explains, PCB designers often consider postprocessing to be a "necessary evil." But CAM350XL, a suite that encompasses DownStream's CAM350 and BluePrint tools, may change that.

Even though IPC APEX Expo is going to have fewer exhibitors and attendees, that doesn't mean there is ample opportunity on both sides of the exhibition equation.