China will likely introduce more measures in the coming year to support the development of cleaner energy, boosting shares of solar companies, according to National Clean Fuels Inc.

Low recycling rates for used TVs, PCs, and other electronics result in the loss of valuable resources, and electronic waste exports risk harming human health and the environment in countries that lack safe recycling and disposal capacity.

Chinese government policies intended to promote the adoption of green technologies are having the desired effect, with the country enjoying a boom in wind power capacity and PV installations that is fueling the establishment of a new generation of global green energy suppliers.

To help executives understand new industry paradigms and manage change, industry leaders and experts will come together at the Electronics Industry Executive Summit: Ideas for a Bright Future in the New Electronics Industry, October 13-14, 2010,

Driven by strong IC market expansion and growth in emerging markets, SEMICON Taiwan 2010 returns to the Taipei World Trade Center September 8-10, 2010 with eight technology theme pavilions focusing on LEDs, MEMS, 3-D ICs and Advanced Packaging/Testing, Green Management, Compound Semiconductors, CMP, AOI and the Secondary Market for capital equipment.

iNEMI releases brief updates on its key environmental projects: Studies on Halogenated Flame Retardant Alternatives, Eco-Impact Evaluator Project, PVC Alternatives for Desktop Power Cords, 2011 ECE Roadmap and iNEMI's Future Environmental Priorities.

Rockwell Collins, as member of a consortium of industry partners led by the Swedish Air Navigation Service Provider "Luftfartsverket" (LFV), has been awarded an active role in the AIRE "Green Connections" project.

Panasonic meets and exceeds "eco ideas" targets in drive to promote sustainability in product lines, in-staff programmes and manufacturing

All Green Electronics Recycling is hosting an unprecedented number of free electronics recycling events throughout the Inland Empire.

According to an independent study1 conducted for enterprise software vendor IFS in the United States, Scandinavia and Benelux, although green measurement is considered important, businesses on both sides of the Atlantic lack the correct systems to track their full environmental footprints.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

I-Connect007's team of editors, guest editors, videographers and video editors worked throughout the show to capture the keynotes, the industry's top technologists and business leaders, bringing our readers and viewers the world's most comprehensive event coverage and content.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?

Companies have taken huge strides toward a greener future by changing their designs to streamline processes and increase the reusability and recycling rate of products.

As 2010 approaches, I-Connect007's European Editor, Pete Starkey, decided to take a look back at the year's top technical articles--compiling a list of the most popular articles across the site.

At the moment, the search for the Holy Grail--a solder that is a direct replacement for tin-lead--has lost a few participants, but the quest goes on within solder manufacturers. However, a replacement seems as elusive as the original.

The IPC (Association Interconnecting Electronics Industries) will be holding two conferences regarding compliance with the current environmental laws November 10-11, 2009, at the Marriott Hotel in Irvine, California.

IPC has co-joined two conferences the week of November 9-12, 2009. Speakers will address the on-going and ever-changing environmental issues facing the industry, as well as materials compliance issues that electronics manufacturers must master to build the products of tomorrow.

The regulatory environment may take a new twist. U.S. legislators are considering a bill that would require companies to track the origin of raw materials, raising several questions about reporting and enforcement.

This paper examines the thermal properties of various halogen-free laminates used in handheld electronic products and correlates these properties with manufacturing requirements. Thermal properties investigated include z-axis CTE, time to delamination at 260°C and 288°C and temperature to decomposition.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

Don't be a victim of slash sheet confusion. Ask for and expect your suppliers to provide clean and real differentiations between their products. Make sure that when you buy a lower cost "alternative" that it is really the same thing you've been using.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?

As 2010 approaches, I-Connect007's European Editor, Pete Starkey, decided to take a look back at the year's top technical articles--compiling a list of the most popular articles across the site.

"Good quality and high reliability are not an accident: They are there by design!" These were the opening words of Artetch Circuits' Martin Morrell as he introduced the SMART Group seminar on high-technology, high-reliability PCBs at the UK's NPL on November 17, 2009.

At the moment, the search for the Holy Grail--a solder that is a direct replacement for tin-lead--has lost a few participants, but the quest goes on within solder manufacturers. However, a replacement seems as elusive as the original.

DMRPCB's Robert Tarzwell is now offering printed electronics kits that will offer fabricators a better understanding of how to manufacture printed electronics circuit boards. He's also teaming with Taiyo America and other partners to help push printed electronics into the mainstream.

The regulatory environment may take a new twist. U.S. legislators are considering a bill that would require companies to track the origin of raw materials, raising several questions about reporting and enforcement.

With so few components now available in a non-RoHS configuration, many customers--particularly defense contractors--are asking flex makers to switch their existing flex circuits over to RoHS-compliance. Al Wasserzug, business development director of Vulcan Flex Circuit Corporation, discusses the impact of this conversion.

Solder-free and 3-D assembly will help bridge the performance and density gaps needed to extend Moore's Law, as lithography on silicon runs out of steam. It will offer America the chance to restore her electronic manufacturing mojo and provide for her security. Please, America, don't miss this chance to leap-frog the rest of the world!

Don't be a victim of slash sheet confusion. Ask for and expect your suppliers to provide clean and real differentiations between their products. Make sure that when you buy a lower cost "alternative" that it is really the same thing you've been using.

The list of replacements for eutectic tin-lead keeps growing, and now, over three years after implementation of the lead-free mandate, new alloys are still being developed. How do you cut through the clutter and find the right alloy?

As 2010 approaches, I-Connect007's European Editor, Pete Starkey, decided to take a look back at the year's top technical articles--compiling a list of the most popular articles across the site.

"Good quality and high reliability are not an accident: They are there by design!" These were the opening words of Artetch Circuits' Martin Morrell as he introduced the SMART Group seminar on high-technology, high-reliability PCBs at the UK's NPL on November 17, 2009.

At the moment, the search for the Holy Grail--a solder that is a direct replacement for tin-lead--has lost a few participants, but the quest goes on within solder manufacturers. However, a replacement seems as elusive as the original.

DMRPCB's Robert Tarzwell is now offering printed electronics kits that will offer fabricators a better understanding of how to manufacture printed electronics circuit boards. He's also teaming with Taiyo America and other partners to help push printed electronics into the mainstream.

As a conservationist, I'm often caught between my desire to be green and my need to pay the bills. But over the years, I've found that going green often means going profitable too.

Remote sensor nodes--used for energy harvesting and environmental monitoring--were the talk of the Sensor Expo in Chicago, Illinois. Will these motes fuel the next killer app for the electronics industry?

In the very near future, certain aspects of printed electronics may indeed make traditional PCB manufacturing obsolete. Are you learning all you can about this very disruptive technology?